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| DATA SHEET MOS FIELD EFFECT TRANSISTOR 2SJ448 SWITCHING P-CHANNEL POWER MOS FET INDUSTRIAL USE DESCRIPTION The 2SJ448 is P-Channel MOS Field Effect Transistor designed for high voltage switching applications. PACKAGE DIMENSIONS (in millimeters) 10.0 0.3 4.5 0.2 3.2 0.2 2.7 0.2 FEATURES * Low On-Resistance RDS(on) = 2.0 MAX. (@ VGS = -10 V, ID = -2.0 A) * * * * 15.0 0.3 3 0.1 4 0.2 Built-in G-S Gate Protection Diodes High Avalanche Capability Ratings Isolated TO-220 Package ABSOLUTE MAXIMUM RATINGS (TA = 25 C) Drain to Source Voltage Gate to Source Voltage Drain Current (DC) Drain Current (pulse)* VDSS VGSS ID(DC) ID(pulse) -250 m25 m4.0 m16 V V A A W W C 123 0.7 0.1 2.54 13.5 MIN. 12.0 0.2 Low Ciss Ciss = 470 pF TYP. 1.3 0.2 1.5 0.2 2.54 0.65 0.1 2.5 0.1 Total Power Dissipation (Tc = 25 C) PT1 Total Power Dissipation (TA = 25 C) PT2 Channel Temperature Storage Temperature Single Avalanche Current** Single Avalanche Energy** * PW 10 s, Duty Cycle 1 % Tch Tstg IAS EAS 30 2.0 150 -4.0 80 1. Gate 2. Drain 3. Source -55 to +150 C A mJ MP-45F(ISOLATED TO-220) Drain ** Starting Tch = 25 C, RG = 25 , VGS = -20 V 0 Gate Body Diode Gate Protection Diode Source Document No. D10029EJ1V0DS00 Date Published May 1995 P Printed in Japan (c) 1995 2SJ448 ELECTRICAL CHARACTERISTICS (TA = 25 C) CHARACTERISTIC Drain to Source On-Resistance Gate to Source Cutoff Voltage Forward Transfer Admittance Drain Leakage Current Gate to Source Leakage Current Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge Gate to Source Charge Gate to Drain Charge Body Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge SYMBOL RDS(on) VGS(off) | yfs | IDSS IGSS Ciss Coss Crss td(on) tr td(off) tf QG QGS QGD VF(S-D) trr Qrr 470 200 70 13 7 34 10 15 4 9 1.0 195 760 -4.0 1.0 MIN. TYP. 1.5 -4.8 2.3 -100 m10 MAX. 2.0 -5.5 UNIT V S TEST CONDITIONS VGS = -10 V, ID = -20 A VDS = -10 V, ID = -1 mA VDS = -10 V, ID = -20 A VDS = -250 V, VGS = 0 VGS = m25 V, VDS = 0 VDS = -10 V VGS = 0 f = 1 MHz ID = -2.0 A VGS(on) = -10 V VDD = -125 V RG = 10 ID = -4.0 A VDD = -200 V VGS = -10 V IF = -4.0 A, VGS = 0 IF = -4.0 A, VGS = 0 di/dt = 50 A/s A A pF pF pF ns ns ns ns nC nC nC V ns nC Test Circuit 1 Avalanche Capability Test Circuit 2 Switching Time D.U.T. RG = 25 PG VGS = -20 0 V IAS ID VDD BVDSS VDS VGS 0 t 50 L VDD PG. D.U.T. RG RG = 10 RL VDD VGS VGS Wave 010 % Form ID ID Wave Form 10 % 0 td (on) ton tr VGS (on) 90 % 90 % 90 % ID 10 % td (off) toff tf t = 1s Duty Cycle 1 % Starting Tch Test Circuit 3 Gate Charge D.U.T. IG = -2 mA PG. 50 RL VDD The application circuits and their parameters are for references only and are not intended for use in actual design-in's. 2 2SJ448 TYPICAL CHARACTERISTICS (TA = 25 C) DERATING FACTOR OF FORWARD BIAS SAFE OPERATING AREA 35 dT - Percentage of Rated Power - % PT - Total Power Dissipation - W 100 80 60 40 20 30 25 20 15 10 5 0 20 40 60 80 100 120 140 160 TOTAL POWER DISSIPATION vs. CASE TEMPERATURE 0 20 40 60 80 100 120 140 160 TC - Case Temperature - C FORWARD BIAS SAFE OPERATING AREA TC - Case Temperature - C DRAIN CURRENT vs. DRAIN TO SOURCE VOLTAGE Pulsed -10 -100 ID - Drain Current - A -10 on S( ) Lim ite d( V G = S = ID(DC) w 10 10 0 1 RD Po m s s s ID - Drain Current - A 20 V) ID(pulse) PW VGS= -20 V -10 V er m -5 -1.0 di ss ip DC at io n Li m -0.1 -1 TC = 25 C Single Pulse itt ed 0 -5 -10 -15 -20 -10 -100 -1000 VDS - Drain to Source Voltage - V VDS - Drain to Source Voltage - V FORWARD TRANSFER CHARACTERISTICS -100 Pulsed ID - Drain Current - A -10 TA = -25 C 25 C 75 C 125 C -1.0 -0.1 VDS = -10 V -15 0 -5 -10 VGS - Gate to Source Voltage - V 3 2SJ448 TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH 1 000 rth(t) - Transient Thermal Resistance - C/W Rth(ch-a) = 62.5 C/W 100 10 Rth(ch-c) = 4.17 C/W 1 0.1 0.01 Single Pulse 0.001 10 100 1m 10 m 100 m 1 10 100 1 000 PW - Pulse Width - s |yfs| - Forward Transfer Admittance - S 100 VDS = -10 V Pulsed RDS(on) - Drain to Source On-State Resistance - FORWARD TRANSFER ADMITTANCE vs. DRAIN CURRENT DRAIN TO SOURCE ON-STATE RESISTANCE vs. GATE TO SOURCE VOLTAGE 3.0 Pulsed ID = 2.0 -4 A -2 A -0.8 A 10 TA = -25 C 25 C 75 C 125 C 1.0 1.0 0.1 -0.1 -1.0 -10 -100 0 -5 -10 -15 ID - Drain Current - A DRAIN TO SOURCE ON-STATE RESISTANCE vs. DRAIN CURRENT 6.0 Pulsed VGS(off) - Gate to Source Cutoff Voltage - V -8.0 VGS - Gate to Source Voltage - V GATE TO SOURCE CUTOFF VOLTAGE vs. CHANNEL TEMPERATURE VDS = -10 V ID = -1 mA RDS(on) - Drain to Source On-State Resistance - 4.0 -6.0 -4.0 2.0 VGS = -10 V -2.0 0 0 -50 0 50 100 150 Tch - Channel Temperature - C -0.1 -1.0 ID - Drain Current - A -10 4 2SJ448 DRAIN TO SOURCE ON-STATE RESISTANCE vs. CHANNEL TEMPERATURE 4.0 SOURCE TO DRAIN DIODE FORWARD VOLTAGE Pulsed RDS(on) - Drain to Source On-State Resistance - 3.0 ISD - Diode Forward Current - A 100 10 VGS = 0 V 10 V 2.0 VGS= -10 V 1 1.0 ID = -2 A -50 0 50 100 150 0.1 0 0.5 1.0 1.5 0 Tch - Channel Temperature - C CAPACITANCE vs. DRAIN TO SOURCE VOLTAGE 1 000 VSD - Source to Drain Voltage - V SWITCHING CHARACTERISTICS 1 000 Ciss, Coss, Crss - Capacitance - pF Ciss td(on), tr, td(off), tf - Switching Time - ns VGS = 0 f = 1 MHz tr 100 tf td(off) td(on) 10 100 Coss 10 Crss 1.0 -1.0 -10 -100 -1 000 1.0 -0.1 -1.0 VDD = -125 V VGS = -10 V RG = 10 -10 -100 VDS - Drain to Source Voltage - V REVERSE RECOVERY TIME vs. DRAIN CURRENT 10 000 ID - Drain Current - A DYNAMIC INPUT/OUTPUT CHARACTERISTICS -200 ID = -6 A -16 VDS - Drain to Source Voltage - V trr - Reverse Recovery time - ns di/dt = 50 A/s VGS = 0 1 000 VDD= -200 V -125 V -50 V -100 -12 -8 100 -4 10 0.1 0 1.0 10 100 0 4 8 12 16 ID - Drain Current - A Qg - Gate Charge - nC 5 VGS - Gate to Source Voltage - V 2SJ448 SINGLE AVALANCHE CURRENT vs. INDUCTIVE LOAD -100 IAS - Single Avalanche Current - A Energy Derating Factor - % 160 140 120 100 80 60 40 20 10 m 100 m 0 25 50 75 100 125 150 SINGLE AVALANCHE ENERGY DERATING FACTOR VDD = -125 V RG = 25 VGS = -20 V 0 IAS < -4 A = -10 ID = -4 A EAS =8 0m J -1.0 VDD = -125 V VGS = -20 V 0 -0.1 RG = 25 100 1m L - Inductive Load - H Starting Tch - Starting Channel Temperature - C 6 2SJ448 REFERENCE Document Name NEC semiconductor device reliability/quality control system. Quality grade on NEC semiconductor devices. Semiconductor device mounting technology manual. Semiconductor device package manual. Guide to quality assurance for semiconductor devices. Semiconductor selection guide. Power MOS FET features and application switching power supply. Application circuits using Power MOS FET. Safe operating area of Power MOS FET. Document No. TEI-1202 IEI-1209 IEI-1207 IEI-1213 MEI-1202 MF-1134 TEA-1034 TEA-1035 TEA-1037 The diode connected between the gate and source of the transistor serves as a protector against ESD. When this device is actually used, an additional protection circuit is externally required if a voltage exceeding the rated voltage may be applied to this device. 7 2SJ448 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices in "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact NEC Sales Representative in advance. Anti-radioactive design is not implemented in this product. M4 94.11 8 |
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